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Narrow IO modules for modular distributed I/O – Nov 26, 2013– Nuremberg, Germany (Techreleased) – The Siemens Industry Automation Division has developed narrow IO modules with a width of just 25 millimeters (mm) for the Simatic ET 200MP distributed I/O. This means that up to 30 modules can be mounted on a standard mounting rail of […]
Narrow IO modules for modular distributed I/O – Nov 26, 2013– Nuremberg, Germany (Techreleased) – The Siemens Industry Automation Division has developed narrow IO modules with a width of just 25 millimeters (mm) for the Simatic ET 200MP distributed I/O. This means that up to 30 modules can be mounted on a standard mounting rail of 830 mm.
The new modules can be combined with the 35-mm modules of the same design which are already established on the market. The new portfolio of 25-mm modules for Simatic ET 200MP includes the following digital input and output modules: DI 16x24VDC BA, DI 32x24VDC BA, DQ 16x24VDC/0.5A BA and DQ 32x24VDC/0.5A BA, as well as the mixed module DI/DQ 16x24VDC/16xDC24V/0.5A BA.
With the same pin assignment for wiring, the circuit and wiring diagrams can be universally used for the two module sizes 25 mm and 35 mm. The new modules also use the easy-to-handle push-in terminal technology. The front connector required for this purpose is supplied together with the module.
The Simatic ET 200MP distributed I/O system features a modular and scalable station design. The IO modules can also be used for centralized automation tasks with the new Simatic S7-1500 controllers. The new 25-mm modules have an extended range of functions as compared to the 35-mm modules – for example with respect to on-delay, parameter assignment or diagnostic options.
