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June 01, 2012 –Santa Clara , USA (Techreleased) – Borrowing engineering methodologies from the automotive and aerospace industries, Intel engineers have created an Ultrabook concept chassis that is a fraction of the cost and equivalent in quality to existing machined aluminum and die cast metal solutions in the market today. Intel said the breakthrough, which involved ‘structural […]
Intel Reaches Breakthrough in Chassis Design for Future Ultrabooks
June 01, 2012 –Santa Clara , USA (Techreleased) – Borrowing engineering methodologies from the automotive and aerospace industries, Intel engineers have created an Ultrabook concept chassis that is a fraction of the cost and equivalent in quality to existing machined aluminum and die cast metal solutions in the market today.
Intel said the breakthrough, which involved ‘structural reduction analysis’ to achieve added strength using existing plastics widely available today, would help lower the cost of Ultrabooks in the near future.The company said it would be sharing the results of its work with its ecosystem partners, and that Ultrabook systems using the new chassis designs would likely become available next year after further refinements in engineering and design.
