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Mitsubishi Electric Develops HVIGBT Module X-Series New Dual –April 06, 2016– Tokyo, Japan (Techreleased) – Mitsubishi Electric Corporation (TOKYO: 6503) announced today that it has developed a next-generation power module called X-Series New Dual HVIGBT module for traction and electric power applications in heavy industries. The new module features higher power density and efficiency for inverters, as […]
Mitsubishi Electric Develops HVIGBT Module X-Series New Dual –April 06, 2016– Tokyo, Japan (Techreleased) – Mitsubishi Electric Corporation (TOKYO: 6503) announced today that it has developed a next-generation power module called X-Series New Dual HVIGBT module for traction and electric power applications in heavy industries. The new module features higher power density and efficiency for inverters, as well as a standardized package that allows for a flexible design of inverter systems.
Samples of the 3.3kV (LV100) version of the New Dual module will be available for shipping from March 2017. That will be followed by 1.7kV, 3.3kV (HV100), 4.5kV and 6.5kV versions in that order from 2018 onwards. The company also plans to add a lower-than 1.7kV version to the lineup in the future.
The modules will be exhibited at major trade shows including MOTORTECH JAPAN 2016 during TECHNO-FRONTIER 2016 in Japan from April 20 to 22, Power Conversion Intelligent Motion (PCIM) Europe 2016 in Nuremberg, Germany, from May 10 to 12, and PCIM Asia 2016 in Shanghai, China, from June 28 to 30.
High-power modules are key devices for controlling power conversion in electronic systems in a wide range of power classes from several kilowatts up to several megawatts. Until now, modules with a maximum voltage rating of up to 6.5kV and a maximum current rating of several thousand amperes have been commercially available.
The New Dual HVIGBT module will satisfy demand for efficient, high power density semiconductor devices with a range of current and voltage ratings, while contributing to higher power output and efficiency in inverters by adopting the latest seventh-generation IGBTs and RFC diodes. Meanwhile, the standardized package dimensions will allow manufacturers of industrial electronics to simplify design and secure multiple sources for inverters.
