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Toshiba’s New ICs For Bluetooth® Smart Devices Feature Built-in Flash ROM–Nov 18, 2015– Tokyo, Japan (Techreleased) – Toshiba Corporation today announced the launch of two Bluetooth® ICs, that both support Bluetooth® Low Energy (LE)[1] ver.4.1 communications. The “TC35676FTG/FSG” integrates built-in Flash ROM, while the “TC35675XBG” supports both Flash ROM and NFC Forum Type 3 Tag for […]
Toshiba’s New ICs For Bluetooth® Smart Devices Feature Built-in Flash ROM–Nov 18, 2015– Tokyo, Japan (Techreleased) – Toshiba Corporation today announced the launch of two Bluetooth® ICs, that both support Bluetooth® Low Energy (LE)[1] ver.4.1 communications. The “TC35676FTG/FSG” integrates built-in Flash ROM, while the “TC35675XBG” supports both Flash ROM and NFC Forum Type 3 Tag for peer-to-peer communication. Sample shipments start today.
The “TC35676FTG/FSG” adds to the current “TC35667FTG/FSG” line-up launched last year. These devices realize low power consumption with an original low-power circuit design and integration of a highly efficient DC-DC converter. The new IC builds on these with the addition of Flash ROM to store user programs and various data for stand-alone uses. The new IC also has a 64KB user program area, achieved by increasing the internal SRAM size that allows its internal ARM® processor to execute various kinds of application programs.
The “TC35675XBG” is an addition to the “TC35670FTG” line-up. Integrated into a product, its NFC Tag realizes easy Bluetooth®peer-to-peer paring and easy power on/off functions simply by touching another NFC supported mobile device, extensions of the “TC35676FTG/FSG” functions.
The new ICs will boost cost performance, as the built-in Flash ROM eliminates any need for an external EEPROM and reduces external part counts and PCB size. They also have the same low power consumption feature as the current ICs and operate long operating times for applications powered by small coin cell batteries. For example, using a CR2032 type coin battery, the new ICs can carry out beacon operation for more than six months[2].
The new ICs will facilitate adoption of Bluetooth® LE communications for high grade small devices, such as wearable healthcare devices, sensors and toys, and will support set makers in optimizing product value.
Bluetooth® Smart devices[4], such as wearable devices, healthcare devices, smart phone accessories, remote controllers, and toys.
| Part Number | TC35675XBG | TC35676FTG/FSG |
|---|---|---|
| Operating Voltage Range | 1.8V-3.6V | |
| Current Consumption in Operation | 5.9mA (@3.3V, -4dBm Transmitter operation or Receive operation) | |
| Current Consumption during Deep Sleep | Less than 100nA (@3.3V) | |
| Operating Temperature Range | -40°C to 85 °C | |
| Package | FBGA52 4.5mm×4.5mm 0.5mm pitch | QFN40 6mm×6mm 0.5mm pitch QFN40 5mm×5mm 0.4mm pitch |
| Bluetooth® Version | Ver.4.1 Including central and peripheral functions |
|
| Transmitter Output Power | 0dBm to -20dBm (4dB steps) | |
| Receiver Sensitivity | -92.5dBm | |
| Profiles | GATT (Generic Attribute Profile), including server and client functions | |
| Interfaces | UART, I2C, SPI, GPIO | |
| Other Features | DC-DC Converter Low drop regulator General purpose ADC User program function Wake up signal for host device PWM function Built-in 192KB Flash ROM |
|
| Tag Communication | NFC Type 3 Tag (FeliCaTM Lite-S compatible)[3] | – |
| Tag Communication Speed | 212Kbps / 424Kbps automatic switchover | – |
| Non-volatile Memory | E2PROM, 2Kbyte | – |
| Security | Mutual recognition by Triple DES MAC (MAC: Message Authentication Code) | – |
